超高精度倒装芯片贴片机 CB-700_封装微组装测试设备_产品中心

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封装微组装测试设备

超高精度倒装芯片贴片机 CB-700

贴片应用：倒装焊特点：

产品详情咨询

产品概述

产品规格表

外形尺寸

功能：贴片应用：倒装焊

特点：

• Ultra-low load, high-accuracy bonding

• Real-time control is possible in the low load range. As a result, bump height variation become minimized.

• Supports ultrasonic bonding by exchanging tools

• Available process: ACF、ACP、NCF、NCP、Au-Sn (Eutectic),Au-Au (Ultrasonic),Solder

Standard Item & Optional Items

[Standard Items]

• Flip chip unit

• Constant heat stage

• ATC（Automatic ceramic tool change)

• Calibration

• Process management(logger/export to another PC)

• Automatic leveling mechanism

• ID Reading

＜Optional Items＞

• Eutectic head ( No heating)

• Eutectic purge jig

• Eutectic stage (52mm pulse heater)

• Transfer function( Flux, Paste)

• Dispenser unit (except dispenser)

• Die bonding

• Chip imaging camera

• Gel pack

• Ultrasonic bonding

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