东京精密TSK全自动探针台-FP2000/FP3000_东京精密TSK探针台_探针台系统_产品中心

FP2000自动传输和支撑薄晶片、单晶片和安装在切割框架上的CSP（芯片尺寸包）基板。此外，也可以探测常规的晶片。FP2000配备了新开发的模具位置校正软件，自动晶片对准功能和自动探针对垫对准。操作和连接测试仪就像传统的探器。

主要的配置选项：

Multiple Die Probing			Wafer ID Reader(Front/Back)
Needle Cleaning			Various Supplier's Testing Head adoptable
GP-IB Interface			Re-probing
PMI:Probe-mark Inspection			Network connection
Printer			Color Camera
Barcode Reader			Flat Loader

● SPECIFICATIONS FP2000
Probing Accuracy		Within±1.5 μm using a wafer (Tokyo Seimitsu's Specification)
Applicable Wafer		Supports wafer or CSP substrate mounted on Dicing Frame(2-8-1,2-6-1) as well as regular wafer.(5,6,8 inch)
X-Y-axis	Stroke	±120 mm (X-Y axis probe area)
	Maximum Speed	X-axis:250 mm/sec Y-axis:200 mm/sec
Z-axis	Stroke	47 mm
	Maximum Speed	30 mm/sec
θ-axis	Rotation Range	±5°
Fine Alignment		CCD ITV Image Processing
Loader	Cassettes Mounts	1
	Wafer Handling	Ceramics Arm
Hard Disk		3.5 in,1 TB or more
USB Interface		External Memory Available
Display		12.1 inch TFT High resolution color LCD
Power		1φAC 100/200/210/220/230/240 V,50/60 Hz,Max:1.3 kVA (including high-temperature specifications)
Air Supply	Source Pressure	0.45 to 0.7 MPa
	Consumuption	Approx.0.1 L/a wafer (Average)(ANR)
Vacuum Supply	Source Pressure	-100 to -53 kPa
	Consumuption	30 L/min or more
Dimentions		1322x1454⁰x943 mm
Weight		Approx.900 kg (standard specifications)
Noise		70 dB or less (CE-MD/SEMI S2)
Others		Contact us for further information about frame,cassette and tester interface