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Packaging micro assembly testing equipment
激光植球机

激光植球机

进口激光植球机
Customer service

* The same model of product may have multiple versions, and there may be differences between different versions of the product (including functional parameters, logo design, appearance details, product information, etc.). Please refer to the actual product for accuracy

Product Overview
Product specifications
External dimensions


功能:


1)可用于CSP、BGA、PCB、晶圆植球

2)支持3D封装


特点:


1)单点激光植球,无需额外回流,无需助焊剂

2)可支持锡球尺寸40um到760um