Shenzhen GBIT Testing Technology Co., Ltd
Shenzhen GBIT Testing Technology Co., Ltd
Phone: 0755-83698930
Email: dongni.zhang@gbit.net.cn
Address: Room 1203, Block C, World Trade Plaza, No. 9 Fuhong Road, Futian District, Shenzhen
全自动芯片挑片分选机 WBS-300
* The same model of product may have multiple versions, and there may be differences between different versions of the product (including functional parameters, logo design, appearance details, product information, etc.). Please refer to the actual product for accuracy
功能:
挑片应用:wafer-wafer,wafer-tray,tray-wafer,tray to tray 之间的挑片。
自动上下料,设备按照输入的Mapping图及AOI检查判定产品,自动分拣芯片。
特点:
多功能全自动挑片系统,支持各类挑片方式
视觉定位系统,直线电机驱动:分拣精度高,速度快
AOI检查系统,挑片过程中检查芯片外观,自动识别形貌
Bond Force Control
支持对三五族,MEMS以及具备空气桥结构芯片的挑选,支持MPW
提供设备功能、治具定制及服务
Options:
2-step sorting:双分拣装置,分步挑片
Air Ejector:对应超薄产品,芯片厚度≥20μm
项目 | 规格参数 |
WAFER 尺寸: | 12inch Option:8inch |
TRAY 尺寸: | 2、4inch |
芯片尺寸: | 0.5x0.5mm~20x20mm Option:0.2x0.2mm~25x25mm |
芯片厚度: | ≥50μm Option:≥20μm |
放置精度: | ≤ ±30μm/≤ ±0.5° Option:≤ ±15μm |
分拣速度: | ≤ 1.0s/chip at 2x2mm Die |
设备尺寸: | 2500(W)x1900(D)x1800(H) mm |
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