Shenzhen GBIT Testing Technology Co., Ltd
Phone: 0755-83698930
Email: dongni.zhang@gbit.net.cn
Address: Room 1203, Block C, World Trade Plaza, No. 9 Fuhong Road, Futian District, Shenzhen
超高精度倒装芯片贴片机 CB-700
* The same model of product may have multiple versions, and there may be differences between different versions of the product (including functional parameters, logo design, appearance details, product information, etc.). Please refer to the actual product for accuracy
功能：贴片应用：倒装焊 特点： • Ultra-low load, high-accuracy bonding • Real-time control is possible in the low load range. As a result, bump height variation become minimized. • Supports ultrasonic bonding by exchanging tools • Available process: ACF、ACP、NCF、NCP、Au-Sn (Eutectic),Au-Au (Ultrasonic),Solder Standard Item & Optional Items [Standard Items] • Flip chip unit • Constant heat stage • ATC（Automatic ceramic tool change) • Calibration • Process management(logger/export to another PC) • Automatic leveling mechanism • ID Reading ＜Optional Items＞ • Eutectic head ( No heating) • Eutectic purge jig • Eutectic stage (52mm pulse heater) • Transfer function( Flux, Paste) • Dispenser unit (except dispenser) • Die bonding • Chip imaging camera • Gel pack • Ultrasonic bonding |
Shenzhen GBIT Testing Technology Co., Ltd
Address: Room 1203, Block C, World Trade Plaza, No. 9 Fuhong Road, Futian District, Shenzhen
Mailbox：dongni.zhang@gbit.net.cn
Tel：0755-83698930
