Shenzhen GBIT Testing Technology Co., Ltd
Phone: 0755-83698930
Email: dongni.zhang@gbit.net.cn
Address: Room 1203, Block C, World Trade Plaza, No. 9 Fuhong Road, Futian District, Shenzhen
精密倒装芯片贴片机 CB-610
* The same model of product may have multiple versions, and there may be differences between different versions of the product (including functional parameters, logo design, appearance details, product information, etc.). Please refer to the actual product for accuracy
芯片倒装键合机
特点：
Correspond to fine pitch of electrodes with mounting accuracy ± 1μm
Correspond yo ultra-low load（0.049N）to high load (490N）without head replacement
follows thermal variation of work and tools in real time
Equipped with recipes for various bonding processes as standard
Feedback of abnormalities by bonding log analysis
Standard Items & Optional Items
＜Standard Items＞
Flip chip unit
Constant heat stage
ATC（ Automatic ceramic tool change )
Calibration
Process management (logger / export to another PC)
Automatic leveling mechanism
＜Optional Items＞
Eutectic head ( No heating )
Eutectic purge jig
Eutectic stage(□52mm pulse heater
Transfer function( Flux, Paste)
Dispenser unit( except dispenser)
Die bonding
Chip imaging camera
Gel pack
Ultrasonic bonding
ID Reading
功能：贴片应用：倒装焊 |
Shenzhen GBIT Testing Technology Co., Ltd
Address: Room 1203, Block C, World Trade Plaza, No. 9 Fuhong Road, Futian District, Shenzhen
Mailbox：dongni.zhang@gbit.net.cn
Tel：0755-83698930
